The layer of the motherboard of communication switch mostly ranges from 6-10. This kind of PCB has a strict requirement in stack up, impedance, trace and space, base material, etc.
In such projects, we will be involved in the R&D process from the beginning as a strategic partner, working with the customers to understand their current and future needs, helping them anticipate any problem or challenge that may surface during the R&D or later production series. We make sure the design are in low cost when it comes to manufacturing and meets the requirement of DFM.
Here is a comment from one of our customers: Flying is the right partner we want. Their depth of knowledge, experience, and scientific expertise is crucial for us to solve difficult R&D problems and manufacturing issues.