HDI PCB Specification
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of PCB market. And its design is able to incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities because of the higher circuitry density. A high density PCB features blind and buried vias and often contains micro vias that the diameter is 0.006 or even less.
Key HDI PCB Benefits
The evolution of high density PCB technology has given engineers more imagination and flexibility than ever before. Designers now have the ability to put more components on both sides of the raw PCB if needed. In essence, an HDI PCB gives designers more space to work with and allows them to put smaller components much closer together. This final results in faster signal transmission will go along well with enhanced signal quality.
HDI PCB is widely used to reduce the weight and overall dimensions of products as well as enhancing the electrical performance of the device. It’s regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, and prominently featured in medical devices, various electronic aircraft parts and components.
High Density PCB of Impeccable Quality
Over the course of a decade in business, Flying has established a hard-earned reputation for manufacturing PCB with the highest quality. Our customized PCB manufacturing capabilities enable you to get the finest quality at competitive prices without min quantity requirements. Our team will run for your PCB files, check your design work and consult with you to ensure that it is ready for manufacturing, and that your boards will meet your performance requirements. We also have an on-site quality control department to verify your finished products and meet your high quality standards.
Capable of manufacturing HDI PCB up to 24 layers in various structures.
|HDI Structures||Type of micorovias||Mass Production||Middle/Small Batch||Prototype||Available|
|1+N+1||Blind vias||Yes||Yes||Yes||4 layers+|
|2+N+2||Blind/Buried staggered vias||Yes||Yes||Yes||6 layers+|
|2+N+2||Blind/Buried stacked vias||Yes||Yes||Yes||6 layers+|
|3+N+3||Blind/Buried staggered vias||/||Yes||Yes||8 layers+|
|3+N+3||Blind/Buried stacked vias||/||/||Yes||8 layers+|
HDI PCB capabilities
|Quality Grade||Standard IPC 2|
|Number of Layers||4 – 24layers|
|Order Quantity||1pc – 10000+pcs|
|Build Time||2days – 5weeks|
|Material||FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination|
|Board Size||Min 0.236*0.236″ | Max 18*24″
Min 6*6mm | Max 457*610mm
0.4mm – 3.0mm
|Copper Weight (Finished)||0.5oz – 2.0oz
|Solder Mask Sides||As per the file|
|Solder Mask Color||Green, White, Blue, Black, Red, Yellow|
|Silkscreen Sides||As per the file|
|Silkscreen Color||White, Black, Yellow|
|Surface Finish||HASL – Hot Air Solder Leveling
Lead Free HASL – RoHS
ENIG – Electroless Nickle/Immersion Gold – RoHS
Immersion Silver – RoHS
Immersion Tin – RoHS
OSP – Organic Solderability Preservatives – RoHS
|Min Annular Ring||4mil(0.1016mm), 3mil(0.0762mm) – laser drill|
|Min Drilling Hole Diameter||6mil(0.1524mm), 4mil(0.1016mm) – laser drill|
|Max Exponents of Blind/Buried Vias||stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected|
|Other Techniques||Flex-rigid combination
Via In Pad
Buried Capacitor (only for proto boards with total area smaller than 1m²)
Developing a PCB prototype offers a fast, cost-effective option for getting your design from concept to production, while minimizing some risks associated with a standard PCB service.
Flex boards are characterized as a distinctly patterned printed circuitry and components arranged high-precised by a malleable basic material.
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