With the use of components in computer and communications equipment faster and faster, a major problem arises from the availability of PCB substrate materials and compatibility with products and processes. This includes the stresses during the assembly process for long exposure to the substrate material as well as the required thermal expansion coefficients of the substrate and components. However, people have now explored two types of substrates: including new organic and inorganic materials, and now a brief look at the basic features of these two substrates.
The organic substrate
The organic substrate has phenolic resin impregnated paper or epoxy resin, polyimide, cyanate ester, BT resin and other impregnated non-woven fabric or glass cloth layer. The use of these substrates depends on the physical properties required for PCB applications, such as operating temperature, frequency, or mechanical strength.
The inorganic substrate
The inorganic substrate includes ceramic and metal materials, such as aluminum, iron, copper. The use of these substrates usually depends on the cooling needs, in addition to iron, inorganic substrate provides a floppy disk driver of motor flux path.